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Proposal Submission Deadline: January 31, 2025

We invite you to submit workshop proposals on any topic related to the research and application areas covered by the MetaCom conference but that represent new research areas and directions, not covered by the main tracks.

Proposal Submission Guidelines

A workshop proposal should consist of a descriptive proposal that is up to 3 pages in length and contain the following information:

• Title of the workshop
• The names, postal addresses, phone numbers, and e-mail addresses of the proposed workshop organizing committee. This committee should consist of at least two persons knowledgeable in the technical issues to be addressed by the workshop
• A brief technical description of the workshop, identification of specific technical issues, focus, and justification of its timeliness
• A brief description of the review process
• Resources required, such as one-day or half-day workshop, expected number of attendees (room size), whether a panel setup is needed, etc.
• A tentative call for papers with important dates (submission of papers, notifications, potential program committee members, potential speakers or keynotes, etc.)
• Information about the previous edition of the workshop (if any) including:
  • History and frequency of the workshop
  • Previous conference co-locations, URLs, if available
  • Approximate attendance

All workshop proposals should be submitted electronically to: Prof. Cheolsoo Park (parkcheolsoo@kw.ac.kr) and Prof. Zhenjiang Li (zhenjiang.li@cityu.edu.hk)

Acceptance will be based on an evaluation of the potential of the workshop for generating useful results, the timeliness of and the expected interest in the topic, and the proposers' ability to lead a successful workshop.

Organizers are expected to perform additional advertising in related communities outside the main MetaCom community, to create and maintain the workshop website, arrange for the collection and refereeing of submissions, and to coordinate the collection and delivery of camera-ready material and IEEE copyright transfers.