Call for Workshop Papers (DIM 2024)


The 2nd International Workshop on Distributed Intelligence for Metaverse (DIM 2024)

August 12-15, 2024 · Hong Kong SAR, China

Contents

Metaverse, an emerging concept, has attracted lots of attention worldwide recently. Exploiting core technologies such as 5G/6G communications, virtualization, AI, and blockchain, metaverse is expected to realize an immersive, embodied, and interoperable virtual world. As a result, the metaverse is believed to have the potential to play a transformative role in gaming, social networking, education, healthcare and more scenarios. However, a fundamental challenge, i.e., distributed intelligence for metaverse, has not been well studied. In the vision of metaverse, a huge number of AI-empowered edge devices, cloud servers and network equipment collaborate in creating and maintaining a shared virtual world. Such a collaboration is critical for robustness, efficiency and security of metaverse. Meanwhile, the interaction between smart devices and servers depends on the efficiency of data perception, transmission and processing in human motion, environment and virtual services. Collecting and tracking data from various terminal devices and conducting online intelligent computation and analysis of a large amount of data is necessary. However, existing distributed computing and networking techniques cannot well deal with these emerging challenges because they still heavily rely on human experiences and involvement. Therefore, research developments and breakthroughs in distributed intelligence will become the cornerstone of metaverse. We invite submissions on the research topic of Distributed Intelligence for Metaverse, covering both theoretical and systems studies.

Submission Guide

Submitted papers must represent original material that is not currently under review in any other conference or journal and has not been previously published. Paper length should not exceed the 6-page standard IEEE conference two-column format (including all text, figures, and references). Please see the Author Information page for submission guidelines in the IEEE MetaCom 2024. All submitted papers will go through a peer review process. All accepted and presented papers will be included in the IEEE MetaCom 2024 proceedings. IEEE reserves the right to exclude an accepted and registered but not presented paper from the IEEE digital library. Please follow the submission link on https://metacom.cc (track DIM) to submit your paper.

Organization Chairs

Peng Li (University of Aizu, Japan)
pengli@u-aizu.ac.jp

Kai Lin (Dalian University of Technology, P. R. China)
link@dlut.edu.cn

Jing Deng (UNC Greensboro, U.S.A)
jing.deng@uncg.edu

TPC Members

Important Dates

"Paper submission deadline, Notification of paper acceptance, Camera-ready paper submissions" as in https://www.ieee-metacom.org/workshop.html