Call for Industry Panels


The 3rd Annual IEEE International Conference on Metaverse Computing, Networking, and Applications (MetaCom 2025)

August 27 — 29, 2025 · Seoul, Republic of Korea

Contents

Proposal Submission Deadline: March 19, 2025

IEEE MetaCom 2025 seeks industry panel proposals on new and emerging topics within the scope of Metaverse and AI. Industry Panels aim at bringing together Speakers from industry and academia, encompassing several sectors, to discuss a timely and relevant topic of interest to conference participants.

Proposal Submission Guidelines

The proposal for an Industry Presentation should follow the attached template indicating the following information:

The information should be sent via email to Industry Panel Chair (Prof. Jeongwook Seo, jwseo@hs.ac.kr), as a *.doc attachment.

Structure

To allow enough time for discussion in the Panel, which is its main goal, the following structure should be followed:

Participation of Speakers

The conference is aimed at in-person attendance, hence, Moderator and Speakers are expected to participate in person as well. Due to travel restrictions, a maximum of 1 Speaker (not the Moderator) is allowed to participate remotely, as an exception.

Presentations from Moderators and Speakers should be uploaded to a local computer prior to the beginning of the session, being given live at the session.

Diversity in the composition of panels must be taken into account.

Schedule

Panels will be held during the conference programme, in parallel to other technical sessions, including industry ones.

Duration

A Panel occupies one conference time-slot, i.e., 1 hour 30 minutes.

Important Dates

Proposal Submission Deadline March 19, 2025