MetaCom 2023
IEEE International Conference on Metaverse Computing, Networking and Applications (IEEE MetaCom 2023)
June 26-28, 2023 · Kyoto, Japan
IEEE
IEEE CS

Organization Committee

  • General Chairs
  • Chonggang Wang

    Interdigital, USA

  • Dusit Niyato

    Nanyang Technological University, Singapore

  • TPC Chairs
  • Ruidong Li

    Kanazawa University, Japan

  • Enzo Mingozzi

    University of Pisa, Italy

  • Max (Chong) Li

    Computecoin Network and Columbia University, USA

  • Keynote Chair
  • Chi-Ming Chen

    AT&T Labs, USA (Retired)

  • Panel Chair
  • Tarek Abdelzaher

    Unniversity of Illinois Urbana-Champaign, USA

  • Tutorial Chairs
  • Yan Zhang

    University of Oslo, Norway

  • Andreas Veneris

    University of Toronto, Canada

  • Workshop Chairs
  • Pietro Manzoni

    Universitat Politècnica de València, Spain

  • Shimin Gong

    Sun Yat-sen University, China

  • Poster Chairs
  • Nobuyuki Muranaka

    Hitachi, Japan

  • Yang Zhang

    Nanjing University of Aeronautics and Astronautics, China

  • PhD Forum Chairs
  • Shantanu Pal

    Deakin University, Australia

  • Zahra Jadidi

    Griffith University, Australia

  • Publicity Chairs
  • Zhengxin Yu

    Lancaster University, UK

  • Flavio Esposito

    Sant Louis University, USA

  • Jie Gao

    Carleton University, Canada

  • William Liu

    Auckland University of Technology, New Zealand

  • Publication Chair
  • Fangxin Wang

    The Chinese University of Hongkong, China

  • Web Chairs
  • Zhenjiang Li

    City University of Hong Kong, China

  • Haihan Nan

    Kanazawa University, Japan

  • Financial Chair
  • Peiying Colleen Ruan

    NVIDIA, Japan

  • Wei He

    Kanazawa University, Japan

  • Registration Chair
  • Yankai Yin

    Kanazawa University, Japan

  • Local Organization Chairs
  • Noriaki Kamiyama

    Ritsumeikan University, Japan

  • Daisuke Umehara

    Kyoto Institute of Technology, Japan

  • Steering Committee
  • Ruidong Li

    Kanazawa University, Japan

  • Chonggang Wang

    Interdigital, USA

  • Mischa Dohler

    Ericsson, USA

  • Jiannong Cao

    The Hong Kong Polytechnic University, China

  • Weisong Shi

    Wayne State University, USA

  • Mahmoud Daneshmand

    Stevens Institute of Technology, USA

Workshops

News

  • Aug 31, 2022

    Web site is up.

  • Aug 31, 2022

    Call for Papers published.

Important Days

  • Dec 30, 2022

    Paper Submission Due

  • Jan 18, 2023

    Paper Submission Due (extended)

  • Feb 6, 2023

    Paper Submission Due (Firm)

  • Mar 15, 2023

    Author Notification

  • May 10, 2023

    Camera-Ready Due

  • Jun 26-28, 2023

    Conference Date

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