IEEE International Conference on Metaverse Computing, Networking and Applications (MetaCom 2023)

June 26-28, 2023 · Kyoto, Japan.

http://www.ieee-metacom.org/2023

Call for Sponsors

The IEEE MetaCom 2023 plans to offers sponsors the following benefits.

LEVEL: Diamond (FEE: $15,000)

• Five complimentary registrations with access to social events
• Option to suggest an invited talk for the conference
• Opportunity to broadcast advertisement video (provided by patron) during conference break
• Small display space for brochures or flyers
• One patron’s material inserted into conference bag
• Recognition at opening and closing sessions
• Listing on conference website (logo, URL, and 100 words descriptions)

LEVEL: Platinum (FEE: $10,000)

• Four Complimentary registrations with access to social events
• Opportunity to broadcast advertisement video (provided by patron) during conference break
• Small display space for brochures or flyers
• One patron’s material inserted into conference bag
• Recognition at opening and closing sessions
• Listing on conference website (logo, URL, and 100 words descriptions)

LEVEL: Gold (FEE: $8,000)

• Three complimentary registrations with access to social events
• Small display space for brochures or flyers
• One patron’s material inserted into conference bag
• Recognition at opening and closing sessions
• Listing on conference website (logo, URL, and 100 words descriptions)

LEVEL: Silver (FEE: $5,000)

• Two complimentary registrations with access to social events
• One patron’s material inserted into conference bag
• Recognition at opening and closing sessions
• Listing on conference website (logo, URL, and 100 words descriptions)

LEVEL: Bronze (FEE: $2,000)

• One complimentary registrations with access to social events
• Recognition at opening and closing sessions
• Listing on conference website (logo, URL, and 100 words descriptions)

Contact

If you are interested in supporting IEEE MetaCom 2023, you are most welcome to do so. For details please send an email to the Chairs.